Feed portion for coupling to a waveguide formed in a substrate, where the feed portion includes vias connected to a connection pad
US11588219B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2019 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Sep 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A waveguide includes a dielectric substrate, a first conductor layer and a second conductor layer formed on a lower surface and an upper surface thereof, a pair of side wall parts forming side walls of both sides of the waveguide, and a feed part feeding an input signal to the waveguide. The feed part includes a feed terminal formed on the lower surface of the dielectric substrate and does not contact the first conductor layer, a first via conductor connected at a lower end thereof to the feed terminal, a first connection pad connected to an upper end of the first via conductor, and second via conductors that are each connected at a lower end thereof to the first connection pad. The sum of the cross-sectional areas of the second via conductors is greater than the sum of the cross-sectional area of the first via conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.