TF-SAW resonator with improved quality factor, RF filter and method of manufacturing a TF-SAW resonator
US11588464B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Mar 14, 2019 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Mar 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6489
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A TF-SAW resonator with improved quality factor is provided. The resonator has its piezoelectric material in the form of a thin film and an electrode structure arranged on the piezoelectric layer. Pitch (P) and metallization ratio (n) are chosen to maximize the quality factor (Q).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.