Low-temperature sinterable copper particle and method for producing sintered body by using the same
US11590569B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2017 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Aug 31, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2999/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
To provide novel low-temperature sinterable copper particles that can be sintered even at a low temperature of, for example, around 100° C. or less, and a method for producing a sintered body by using the same. The low-temperature sinterable copper particles according to the present invention are coated with a carboxylic acid, and a surface of the copper particle is oxidized so as to have a cuprous oxide fraction (Cu2O/(Cu+Cu2O)) in the copper particle of 4% by mass or less or so as to have an average coating thickness of cuprous oxide of 10 nm or less. The low-temperature sinterable copper particles are subjected to low-temperature firing in an atmosphere of 0.01 Pa or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.