Method and compositions for embedding electronics in fiber-composite parts fabricated via compression molding
US11590719B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | May 18, 2021 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Aug 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0275
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A fiber-composite part having one or more electronic components that are located in arbitrary regions of the internal volume of the part are fabricated using a preform charge. The preform charge has a structure that corresponds to that of the mold cavity in which the part is being formed. By incorporating the electronic components in the preform charge, such components are then precisely located, spatially oriented, and constrained, and such location and orientation is maintained during molding to produce a part with the electronic components in the desired locations and orientations within its internal volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.