Multi-layer structure and method of making same

US11591257B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Satish Chandra Chaparala · Corning, US
• Kristen Lorraine Eckart · Corning, US
• Kurt Edward Gerber · Dansville, US
• Ming-Huang Huang · Ithaca, US
• Nagaraja Shashidhar · Corning, US
• Huan-Hung Sheng · Horseheads, US
• Michael Lesley Sorensen · Waverly, US
• Ananthanarayanan Subramanian · Corning, US

Key dates

• Filing date: Apr 4, 2018
• Grant date: Feb 28, 2023
• Expiry date: Jun 22, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/0195
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A multi-layer and method of making the same are provided. The multi-layer, such as a sensor, can include a high strength glass overlay and a lamination layer on a substrate layer. The overlay can be less than 250 micrometers thick and have at least one tempered surface incorporating a surface compression layer of at least 5 micrometers deep and a surface compressive stress of at least 200 MPa. The overlay can exhibit a puncture factor of at least 3000 N/μm2 at B10 (10th percentile of the probability distribution of failure) in a multi-layer structure, an apparent thickness of less than 0.014 mm, and a pencil hardness greater than 6H. The method can include ion-exchange tempering at least one major surface of a glass sheet, light etching the major surface to remove flaws and laminating the glass sheet on the tempered and lightly etched major surface to a substrate layer.