Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structure
US11594401B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2020 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Mar 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for processing semiconductor wafer is provided. The method includes loading a semiconductor wafer on a top surface of a wafer chuck. The method also includes supplying a gaseous material between the semiconductor wafer and the top surface of the wafer chuck through a first gas inlet port and a second gas inlet port located underneath a fan-shaped sector of the top surface. The method further includes supplying a fluid medium to a fluid inlet port of the wafer chuck and guiding the fluid medium from the fluid inlet port to flow through a number of arc-shaped channels located underneath the fan-shaped sector of the top surface. In addition, the method includes supplying a plasma gas over the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.