Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus
US11594443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2020 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Mar 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate bonding apparatus includes a first bonding chuck configured to support a first substrate and a second bonding chuck configured to support a second substrate such that the second substrate faces the first substrate. The first bonding chuck includes a first base, a first deformable plate on the first base and configured to support the first substrate and configured to be deformed such that a distance between the first base and the first deformable plate is varied, and a first piezoelectric sheet on the first deformable plate and configured to be deformed in response to power applied thereto to deform the first deformable plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.