Semiconductor device and method of manufacturing the same
US11594514B2 · kind B2 · utility
0Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2020 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Sep 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a semiconductor device includes a substrate, a lower pad provided above the substrate, and an upper pad provided on the lower pad. The lower pad includes a first pad and a plurality of first connection portions provided on the first pad, and the upper pad is provided on the plurality of first connection portions, or the upper pad includes a second pad and a plurality of second connection portions provided under the second pad, and the lower pad is provided under the plurality of second connection portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.