Mask and method of manufacturing mask
US11594681B2 · kind B2 · utility
0Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2022 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Mar 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/166
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for manufacturing a mask includes providing a mask mother substrate including a first portion and a plurality of second portions adjacent to the first portion, forming a reflecting plate on the mask mother substrate, forming a photoresist layer on the reflecting plate, removing a third portion of the photoresist layer that overlaps the plurality of second portions using an auxiliary mask, removing a fourth portion of the reflecting plate that overlaps the plurality of second portions, and removing the plurality of second portions of the mask mother substrate using a laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.