Apparatus and system of a printed circuit board (PCB) including a radio frequency (RF) transition
US11596055B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2019 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Dec 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.