Substrate motherboard and manufacturing method thereof, driving substrate and display device
US11596062B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 22, 2021 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Jun 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a substrate motherboard including: a first substrate base, a first conductive pattern layer, at least one first insulating layer and a second conductive pattern layer which are sequentially arranged. The first conductive pattern layer includes a plurality of signal lines in the active region. The second conductive pattern layer includes a plurality of connection terminals in the active region, and the plurality of connection terminals are electrically coupled to corresponding signal lines in the plurality of signal lines. The substrate motherboard further includes a plurality of leading-out wires and a plurality of detection terminals in the non-active region, first ends of the plurality of leading-out wires are electrically coupled to corresponding connection terminals and extending to the non-active region to be electrically coupled to corresponding detection terminals through second ends thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.