Apparatus for depositing conductive and nonconductive material to form a printed circuit
US11596071B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2020 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Nov 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.