Microneedle, mold for production of microneedle array, and production method of microneedle array using same
US11596397B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2019 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Aug 29, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/756
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention includes producing a preliminary mold (10-1 or 20-1) provided with two-dimensional patterns (111 or 211) having a shape of a microneedle array (30) therein; producing microneedle array molds (10 and 10-2 or 20 and 20-2) having a three-dimensional shape by expanding air inside the patterns (111 or 211) having a two-dimensional shape to deform the patterns (111 or 211) having the two-dimensional shape into molds having the three-dimensional shape; and after pouring a biodegradable resin into the microneedle array molds (10 and 10-2 or 20 and 20-2) and solidifying the biodegradable resin, completing the microneedle array (30) by removing the microneedle array molds (10 and 10-2 or 20 and 20-2), thereby providing a mold for production of a microneedle array and a production method of the microneedle array using the same capable of tightly suturing an affected area without inducing pain.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.