Adhesion prevention film for medical devices and medical device
US11596719B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Aug 20, 2018 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Jan 6, 2042 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L2420/04
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200° C. or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.