Biofilm resistant medical implant
US11596720B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2019 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Aug 15, 2041 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L2430/02
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface; depositing silver and/or copper onto the outer surface of the implant; diffusing the silver and/or copper into a subsurface zone adjacent the outer surface; and oxidizing or anodizing the implant after the diffusion step to form an oxidized or anodized layer that contains at least some amount of elemental silver, elemental copper or silver or copper ions or compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.