Monitoring additive manufacturing
US11597156B2 · kind B2 · utility
2Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2018 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Oct 29, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/10048
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Examples of methods for monitoring additive manufacturing by an electronic device are described herein. In some examples, a predicted thermal image is calculated for a layer. In some examples, a captured thermal image is obtained for the layer. In some examples, a risk score is calculated for the layer based on the predicted thermal image and the captured thermal image. In some examples, a mitigation operation is performed in response to determining that the risk score is outside of a threshold range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.