Patent · US Active

Packaged die and assembling method

US11597647B2 · kind B2 · utility

0Cited by

4References

19Claims

0Family size

Assignee

TDK CORPORATION · JP

Inventors

Andreas Barbul · Munich, DE
Matthias Schmidt · Munich, DE
Matthias König · Freising, DE

Key dates

Filing date	Dec 9, 2020
Grant date	Mar 7, 2023
Priority date	—
Expiry date	Dec 9, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/17151
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an embodiment A package includes a casing having an opening and enclosing a cavity, a die accommodated in the cavity and a membrane attached to the casing, the membrane being air-permeable, covering and sealing the opening, wherein the membrane is configured to allow only a lateral gas flow, and wherein a blocking member is configured to block a vertical gas flow through the membrane into the cavity, the blocking member tightly covering a surface of the membrane at least in an area comprising the opening.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.