Dual wafer plating fixture for a continuous plating line

US11598018B2 · kind B2 · utility

Assignee

• SUNPOWER CORPORATION · US

Inventors

• Hung-Ming Wang · Taipei, TW
• Paul Loscutoff · Castro Valley, US
• Raphael M. Manalo · San Jose, US
• Arnold Villamor Castillo · Cuenca, PH
• Mohamad Ridzwan Mustafa · Johor Bahru, MY
• Mark Kleshock · Phoenix, US
• Neil G. Bergstrom · Los Altos, US

Key dates

• Filing date: Mar 7, 2019
• Grant date: Mar 7, 2023
• Expiry date: Feb 5, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F19/902
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.