Tungsten-rhenium composite thin film thermocouple based on surface micropillar array with gas holes
US11598676B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2022 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Jun 23, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/021
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.