Photopolymerizable resin composition, display device using same, and manufacturing method thereof
US11599024B2 · kind B2 · utility
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31Claims
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Key dates
| Filing date | Jan 14, 2020 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Jan 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/131
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photopolymerizable resin composition includes a first layer and a second layer; and a barrier layer disposed between the first layer and the second layer, the barrier layer includes one or more of SiNx, SiOx, SiON, Mo, a Mo oxide, Cu, a Cu oxide, Al, an Al oxide, Ag, and a Ag oxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.