Soldering process parameter suggestion method and system thereof
US11599803B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2019 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Mar 18, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06N20/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A soldering process method includes steps of: establishing a material component database; establishing a working parameter database; analyzing material and component characteristics required for a new soldering process; comparing the characteristics with information in the material component database; selecting operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; performing the soldering process using the operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; measuring and recording the soldering process execution information and the final product information; determining whether the final product of the solder process meets the quality control requirements; using the machine learning method to fit the soldering process execution information and the final product information of the solder process to get the operating parameters for the next soldering process when the final product does not meet the quality control requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.