Micro pick up array and manufacturing method thereof
US11600509B2 · kind B2 · utility
1Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2018 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Jan 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.