Semiconductor package with expanded heat spreader

US11600547B2 · kind B2 · utility

Assignee

• Infineon Technologies Austria AG · AT

Inventors

• Jo Ean Joanna Chye · Kampung Bukit Kechil, MY
• Teck Sim Lee · Melaka City, MY
• Ke Yan Tean · Melaka City, MY
• Wei Wang · Hsinchu, TW

Key dates

• Filing date: Dec 2, 2019
• Grant date: Mar 7, 2023
• Expiry date: Nov 6, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor package includes a die pad having a die attach surface, a first laterally separated and vertically offset from the die pad, a semiconductor die mounted on the die attach surface and comprising a first terminal on an upper surface of the semiconductor die, an interconnect clip that is electrically connected to the first terminal and to the first lead, and a heat spreader mounted on top of the interconnect clip. The interconnect clip includes a first planar section that interfaces with the upper surface of the semiconductor die and extends past an outer edge side of the die pad. The heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die. The heat spreader laterally extends past a first outer edge side of the die pad that faces the first lead.