Composite substrate and manufacturing method thereof
US11600706B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2021 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Sep 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0254
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite substrate is provided in some embodiments of the present disclosure, which includes a substrate, an insulation layer, a first silicon-containing layer and a first epitaxial layer. The insulation layer is disposed on the substrate. The first silicon-containing layer is disposed on the insulation layer, in which the first silicon-containing layer includes a plurality of group V atoms. The first epitaxial layer is disposed on the first silicon-containing layer, in which the first epitaxial layer includes a plurality of group III atoms. A distribution concentration of the group V atoms in the first silicon-containing layer increases as getting closer to the first epitaxial layer, and a distribution concentration of the group III atoms in the first epitaxial layer increases as getting closer to the first silicon-containing layer. A method of manufacturing a composite substrate is also provided in some embodiments of the present disclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.