System and method for shingling wafer strips connected in parallel
US11600733B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jul 9, 2021 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Jul 9, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
Abstract
A solar device includes a first string of first solar wafers, wherein a plurality of the first solar wafers each overlap with at least one vertically adjacent solar wafer from the first string. Additionally, the solar device includes a second string of second solar wafers, wherein a plurality of the second solar wafers each overlap with at least one vertically adjacent solar wafer from the second string, wherein a plurality of the first solar wafers overlap with one or more of the plurality of second solar wafers to electrically connect horizontally adjacent solar wafers in parallel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.