Backplane connector with improved structure
US11600952B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2021 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Nov 3, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A backplane connector includes a number of wafers and a spacer for assembling the wafers together. Each wafer includes an insulating frame and a number of conductive terminals fixed to the insulating frame. The insulating bracket includes a first protrusion and a second protrusion. The spacer includes a first body portion and a second body portion. The first body portion includes a first clamping slot for clamping the first protrusion. The second body portion includes a second clamping slot for clamping the second protrusion. The present disclosure increases the ability of the spacer to resist external forces and improves the structural stability of the backplane connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.