Integrated sub-assembly for wearable audio device
US11601746B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 5, 2019 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Sep 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/1066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An audio headset sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) providing the operative functionality for true wireless headphones/headset (100) includes circuitry operative to effect wireless communication and audio signal processing, and a battery (212). These circuits and battery (212) are contained in a sealed enclosure (610, 710, 1210, 1310). In one embodiment, the sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) includes all electronic components for wireless communications and audio signal processing, and a battery (212), but does not include a speaker. A microphone (240) may be part of the sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) or may be external. In another embodiment, a speaker (230) is part of the sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) as well. The sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) may include several cavities (1254, 1252) and vents (1264, 1262) before and behind the speaker (230) for optimal acoustic performance. The sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500), and any necessary external audio components, can be inserted in an external housing (104) forming the visual product appearance and the anthropome…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.