Double-sided hybrid cooling of PCB embedded power electronics and capacitors
US11602087B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 2, 2021 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Apr 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.