Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
US11602800B2 · kind B2 · utility
1Cited by
18References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2019 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Jun 1, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.