Multi-laser cutting method and system thereof
US11602804B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2020 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Apr 15, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K37/003
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention discloses that a multi-laser cutting method and system, which is applied to a substrate to form a primary substrate having a pattern of rounded corners and a line, the throughput could be improved because CO2 laser cannot cut the round corner at the high speed, but the substrate strength could be kept due to the high cutting quality of the lines by CO2 laser. The poor quality of the cutting edges of the round corners will not affect on the substrate strength but the round corner cutting by the second laser unit will speed up the cutting process. The present invention applies the method by the 2 different laser machines to balance the throughput. Because at the same speed, for example 150 mm/sec, the cycle time per 1 substrate will be different due to the different length of the cutting lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.