Patent · US Active

Method for cutting refractory metals

US11602816B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Friedhold Scholz · Rodenbach, DE
Egbert Stiedl · Hanau, DE
Bernd Spaniol · Hammersbach, DE
Norbert Traeger · Maintal, DE
Werner Feuring · Hanau, DE

Key dates

Filing date	Nov 20, 2017
Grant date	Mar 14, 2023
Priority date	—
Expiry date	Feb 8, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23D59/04
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The invention relates to a method for cutting refractory metals, in which a solid body (1) made of a refractory metal is mechanically machining cut with a cutting apparatus (4, 7), wherein the cutting apparatus (4, 7) is wetted for cutting with a fluid (6) having at least 50 weight % water, wherein the cutting apparatus (4, 7) is brought to a positive electrical potential in relation to the solid body (1) during cutting. The invention also relates to a disc produced from a refractory metal using such a method, and such a disc that has an oxide layer with a thickness of between 2 nm and 1,000 nm on the cutting surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.