Cleaning compositions and methods of use thereof
US11603512B2 · kind B2 · utility
1Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2021 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Oct 21, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure relates to cleaning compositions that can be used to clean semiconductor substrates. These cleaning compositions can be used to remove defects arising from previous processing steps on these semiconductor substrates. These cleaning compositions can remove the defects/contaminants from the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one organic acid and at least one anionic polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.