Leadless pressure sensor
US11604110B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 3, 2020 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Mar 29, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/147
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Pressure sensor systems that include a pressure sensor die and other components in a small, space-efficient package, where the package allow gas or liquid to reach either or both sides of a membranes of the pressure sensor die. A package can include a substrate and a cap, where either or both the substrate and the cap divide the package internally into two chambers. The substrate can have a solid bottom layer, a middle layer having a slot or path running a portion of the length of the layer, and a top layer having two through-holes that provide access to the slot or path. The cap can have two ports. A first port can lead to a first chamber where a top side of a pressure sensor is in the first chamber. A second port can lead to a second chamber and the slot or path, where the slot or path leads to a bottom side of the pressure sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.