Circuit board including insulating layer having a plurality of dielectrics with different dielectric loss, and electronic device including the circuit board
US11605891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2019 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Jul 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0187
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a communication circuit electrically connected with a circuit board. The circuit board includes a first portion comprising a first layered structure in which a wiring layer and a first insulating layer are alternately positioned, and a second portion comprising a second layered structure in which the wiring layer and the first insulating layer are alternately positioned and a second insulating layer. At least one antenna patch is positioned on or within the second insulating layer. A conductive line penetrates the second layered structure and the second insulating layer and electrically connects the at least one antenna patch and the communication circuit. The first insulating layer has a first loss tangent value, and the second insulating layer has a second loss tangent value smaller than the first loss tangent value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.