Electronic device having electronic components with different temperature specifications
US11606881B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2021 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Jul 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1427
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device is provided. The electronic device includes a housing, a first circuit board, and a first heat sink. The housing forms a receiving space. The first circuit board and the first heat sink are received in the receiving space along the gravity direction. One side of the first circuit board has at least one electronic element. The first heat sink has a first base board and at least first side board. The first base board is arranged adjacent to the first circuit board. The electronic element transferred heat to the first base board. The first side board connects to the first base board, and cooperatively forms a first heat dissipating channel along the gravity direction. The first side board is close to or contacts the housing, so that the heat of the electronic element can be transferred by heat conduction and heat convection to dissipate outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.