Patent · US Active

Method for manufacturing a substrate having a region mechanically decoupled from a support, method for manufacturing at least one spring, and a substrate

US11608264B2 · kind B2 · utility

0Cited by

3References

11Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Arne Dannenberg · Metzingen, DE
Mike Schwarz · Aspenhausiedlung, DE
Thomas Friedrich · Bietigheim-Bissingen, DE

Key dates

Filing date	Dec 15, 2017
Grant date	Mar 21, 2023
Priority date	—
Expiry date	May 4, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2201/0133
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for manufacturing a substrate including a region, which is mechanically decoupled from a support and has at least one component situated on the region; at least one recess being introduced on a front side of the substrate; an etching pattern being prepared on a back side of the substrate and etched anisotropically in such a manner, that vertical channels are produced on the back side of the substrate; and subsequently, a cavity being introduced at the back side of the substrate; the at least one recess on the front side of the substrate being connected to the cavity on the back side of the substrate; and in at least one region between the front side of the substrate and the cavity, at least two recesses or at least two segments of a recess being interconnected by at least one channel.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.