Curable and cured adhesive compositions
US11608399B2 · kind B2 · utility
2Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2021 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Dec 4, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2891
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10−4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10−3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.