Diffusion barrier for implantable electrode leads
US11610703B2 · kind B2 · utility
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5References
15Claims
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Assignee
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Key dates
| Filing date | Jun 3, 2019 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Jan 18, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2535/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.