Patent · US Active

Method for introducing at least one cutout or aperture into a sheetlike workpiece

US11610784B2 · kind B2 · utility

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21Claims

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Assignee

LPKF LASER & ELECTRONICS SE · DE

Inventors

Norbert Ambrosius · Kevelaer, DE
Roman Ostholt · Langenhagen, DE

Key dates

Filing date	Aug 7, 2015
Grant date	Mar 21, 2023
Priority date	—
Expiry date	Jun 18, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/0017
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for introducing at least one cutout, in particular in the form of an aperture, into a sheetlike workpiece having a thickness of less than 3 mm, involving detecting a laser beam onto the surface of the workpiece, selecting the exposure time of the laser beam to be extremely short so that only a modification of the workpiece concentrically around a beam axis of the laser beam occurs, such a modified region having defects resulting in a chain of blisters, and, as a result of the action of a corrosive medium, anisotropically removing material by successive etching in those regions of the workpiece that are formed by the defects and have previously been modified by the laser beam, resulting, along the cylindrical zone of action, in producing a cutout as an aperture in the workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.