High performance module for SiP
US11610844B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Oct 11, 2018 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Oct 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.