Display panel, manufacturing method thereof, and display device
US11611025B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2020 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Jun 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application provides a display panel, a manufacturing method thereof, and a display device. The present application adopts a molybdenum/copper stackup to form a solder pad for bonding, which can effectively solve a problem of a poor bonding force between MTD and a soldering material in the prior art. Meanwhile, a bonding lead is made of titanium-molybdenum-nickel alloy/copper/titanium-molybdenum-nickel alloy stackup, which can reduce manufacturing processes of the display panel and reduce manufacturing costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.