Systems and methods for addressing pumping of thermal interface materials in high-power laser systems
US11611189B2 · kind B2 · utility
1Cited by
1References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2019 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Nov 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4087
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In various embodiments, laser devices feature means, such as fasteners, for attaching a laser package to a cooling plate, which allow motion of the laser package in response to thermal cycles resulting from operation of a beam emitter therewithin. Embodiments of the invention additionally or instead include laser devices featuring segmented barrier layers for electrically isolating the laser package from the cooling plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.