Heat dissipation device
US11612050B2 · kind B2 · utility
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13Claims
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Assignee
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Key dates
| Filing date | Dec 7, 2020 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Aug 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.