Method of diffusion bonding utilizing vapor deposition
US11612947B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2020 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Mar 31, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of diffusion bonding utilizing vapor deposition comprises depositing a coating from a vapor comprising a temperature suppressant element onto a surface of a first component comprising a metal alloy, thereby forming a vapor deposited coating comprising the temperature suppressant element; assembling the first component with a second component comprising a mating surface to form an assembly, the vapor deposited coating contacting the mating surface; and exposing the assembly to a bonding temperature and a compressive force, thereby diffusion bonding the first component to the second component and forming a monolithic third component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.