Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors
US11613460B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 27, 2021 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Apr 27, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/035
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.