Thermoplastic composition
US11613608B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2018 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic elastomer composition comprising a blend of (A) thermoplastic materials comprising (A1) a polyamide block copolymer and (A2) one or more thermoplastic organic polymers excluding (A1), with (B) a silicone composition comprising (B1) a silicone base comprising (B1a) a diorganopolysiloxane polymer having a viscosity of at least 1000000 mPa·s at 25° C. and an average of at least 2 alkenyl groups per molecule, (B1b) a reinforcing filler in an amount of from 1 to 50% by weight of polymer (B1a), and (B2) an organohydrido silicone compound which contains an average of at least 2 silicon-bonded hydrogen groups per molecule, (C) a hydrosilylation catalyst, which composition may additionally optionally comprise (D) one or more additives; wherein the weight ratio (A):(B) is in the range 50:50 to 95:5, and wherein component B2 and C being present in an amount sufficient to cure said silicone composition B.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.