Thermoplastic resin composition and molded article formed therefrom
US11613650B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Dec 31, 2018 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Oct 31, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2650/40
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition of the present invention comprises: about 5 wt % to about 35 wt % of a modified polyaryletherketone resin comprising a repeat unit represented by chemical formula 1; about 5 wt % to about 35 wt % of a polyether ether ketone resin; about 20 wt % to about 40 wt % of a polyphenylsulfone resin; and about 15 wt % to about 50 wt % of glass fibers. The thermoplastic resin composition has good properties in terms of adhesion to metals, impact resistance, and so on.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.