Through-silicon via detecting circuit, detecting methods and integrated circuit thereof
US11614481B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2021 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Jun 8, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2843
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A TSV detecting circuit, TSV detecting methods, and an integrated circuit thereof are disclosed by the present disclosure. The TSV detecting circuit includes a first detecting module includes: a first comparison unit; a first input unit, for transmitting an input signal to a first input of the first comparison unit controlled by a first clock signal; a first switching unit for transmitting a signal of a first node to a second input of the first comparison unit controlled by a first detection control signal, the first node coupled to a first terminal of the TSV; and a second detecting module includes: a second input unit for transmitting the input signal to a second node controlled by a second clock signal; a second switching unit for transmitting a signal of the second node to a second terminal of the TSV controlled a second detection control signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.