Artificial reality system using superframes to communicate surface data
US11615576B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2021 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Oct 8, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09G2370/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This disclosure describes efficient communication of surface texture data between system on a chip (SOC) integrated circuits. An example system includes a first integrated circuit and a second integrated circuit communicatively coupled to the first integrated circuit by a video communication interface. The first integrated generates a superframe in a video frame of the video communication interface for transmission to the second integrated circuit. The superframe includes multiple subframe payloads that carry surface texture data to be updated in the frame and corresponding subframe headers that include parameters of the subframe payloads. The second integrated circuit includes a direct access memory (DMA) controller. The DMA upon receipt of the superframe, writes the surface texture data within each of the subframe payloads directly to an allocated location in memory based on the parameters included in the corresponding one of the subframe headers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.