Clustering sub-care areas based on noise characteristics
US11615993B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Nov 9, 2020 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Sep 10, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A care area is determined in an image of a semiconductor wafer. The care area is divided into sub-care areas based on the shapes of polygons in a design file associated with the care area. A noise scan of a histogram for the sub-care areas is then performed. The sub-care areas are clustered into groups based on the noise scan of the histogram.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.